Based on the latest Intel® Core™ i7 platform, the F23P offers a higher computing performance and a strongly improved graphics performance while having a similarly low power consumption as third generation processors.
Being another member of MEN’s scalable CompactPCI® and CompactPCI® PlusIO family, the F23P is extremely robust and flexible and can easily be integrated into existing systems.
Backwards compatibility and high scalability
The Intel® i7-4700EQ quad core processor reaches a base frequency of 2.4GHz and a Turbo Boost frequency of 3.4GHz. Its excellent graphics and high-computing performance make the F23P a good match for applications in the industrial area, in avionics and space technology, medical engineering and transportation. Depending on the requirements, the F23P can be customized with the full range of Intel® Core™ i7, Core i5, Core i3 and Celeron® processors of the fourth generation.
The front of the board gives access to VGA graphics, 2Gb ethernet and two USB 2.0. Additional functions such as a multitude of UARTs, four USBs, SATA or HD Audio can be used through the connection of extension cards.
The F23P supports the CompactPCI® PlusIO (PICMG 2.30) specification, meaning it can be used in a hybrid system for control of both CompactPCI® and CompactPCI® Serial peripheral boards. Compliant to the standard, four USB 2.0, four PCI Express® x1, four SATA 6Gb/s interfaces and 1Gb ethernet ports are accessible on the J2 rear I/O connector.
The F23P operates in Windows® and Linux environments and under real-time operating systems that support Intel®’s multi-core architecture. Equipped with special components of the Intel® Embedded Line, the F23P has a guaranteed minimum availability of seven years. Also, the F23P is backwards compatible with all predecessor models complying with PICMG 2.30 (F19P, F21P, F22P) and PICMG 2.0 (F14, F18).
An mSATA disk and a microSD™ card connected via USB give the board additional memory space for each application and different watchdogs for monitoring the processor and board temperature top off the functionality of the F23P.
All components of the F23P, including the DDR3 DRAM memory with a size of up to 16GB and ECC functionality, are firmly soldered against shock and vibration.
Features include:
- Intel® Core™ i7, 4th generation
- Up to 16GB DDR3 DRAM soldered, ECC
- Front I/O: VGA, 2Gb ethernet, two USB
- Rear I/O: 4 PCIe®, 4 USB, 4 SATA, 1Gb ethernet
- 2.4GHz to 3.4GHz Turbo Boost, Hyper-Threading, Active Management Technology
- Open CL Support
- For CompactPCI® systems or CompactPCI® PlusIO hybrid systems (PICMG 2.0, 2.30 and CPCI-S.0).